One-component, low-pressure polyurethane adhesive designed for bonding expanded polystyrene and thermal insulation boards in BSO thermal insulation systems and XPS and EPS boards when insulating foundations and underground parts of buildings, basements, etc.
| Color | light yellow |
| Working temperature of the substrate, from ... to, °C | -5 ... +30 |
| Correction time (at +23°C / RH 50%), approx., min | 4 |
| Mechanical fixing time, approx., h | 2 |
| Adhesive coating (for the substrate), area up to, m2 | 12 |
| Packaging capacity (ETICS), area up to, m2 | 8 |
| Flammability | B3 (DIN 4102) F (EN 13501) |
| Strength, kPa:
- inclination - tension |
≥ 75 ≥ 80 |
| Solubility in organic solvents | acetone, before hardening |
| * All measurements were made under normal climatic conditions (+23°C+ 2°C, relative humidity 50 ±5%), unless otherwise stated. |
One-component, low-pressure polyurethane adhesive designed for bonding expanded polystyrene and thermal insulation boards in BSO thermal insulation systems and XPS and EPS boards when insulating foundations and underground parts of buildings, basements, etc.
| Color | light yellow |
| Working temperature of the substrate, from ... to, °C | -5 ... +30 |
| Correction time (at +23°C / RH 50%), approx., min | 4 |
| Mechanical fixing time, approx., h | 2 |
| Adhesive coating (for the substrate), area up to, m2 | 12 |
| Packaging capacity (ETICS), area up to, m2 | 8 |
| Flammability | B3 (DIN 4102) F (EN 13501) |
| Strength, kPa:
- inclination - tension |
≥ 75 ≥ 80 |
| Solubility in organic solvents | acetone, before hardening |
| * All measurements were made under normal climatic conditions (+23°C+ 2°C, relative humidity 50 ±5%), unless otherwise stated. |
